Benefits of Nitrogen / Reflow Soldering Process :

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• Flexibility - Wider ‘Process Window’

• Use of low solids

• Reduced cleaning - residues not polymerized

• Reduced Automatic Testing False Fails

• Reduce BGA Voiding - 60%+Less

• Reduced Defects / Increased Yield

• Increase Joint Reliability

• Aesthetic / Shiny joints

• Eliminate Tomb Stoning effect

• Eliminate Solder Balling effect